About to MEEIE 2026

The 2026 International Conference on Mechanical Engineering and Electronic Information Engineering will be held grandly in Beijing, China. This conference is jointly organized by well-known universities, research institutions, and high-tech enterprises at home and abroad, aiming to build an interdisciplinary and high-level international academic exchange platform, gathering experts, scholars, engineers, researchers, and industry representatives in mechanical engineering, electronic information technology, automation, intelligent manufacturing, and related fields to jointly explore the integration of cutting-edge technologies and engineering innovation applications. The conference will focus on core issues such as intelligent equipment and robot technology, advanced manufacturing and industrial Internet, embedded systems and the Internet of Things, electromechanical integration design, signal processing and communication technology, new energy power systems, and the cross application of artificial intelligence in mechanical and electronic engineering. Promote the deep integration of theoretical research, technological innovation, and industrial practice through keynote speeches, thematic forums, technology exhibitions, paper reports, and industry university research collaborations. MEEIE 2026 cordially invites professionals from relevant fields around the world to actively submit and participate in the conference, working together to promote the collaborative breakthrough of mechanical and electronic information engineering, and contribute technological strength and innovative wisdom to the intelligent transformation and high-quality development of the global manufacturing industry.